Vacuum robot apparatus for variable pitch access

ABSTRACT

Methods, system, and devices including a robot apparatus with at least one lower arm configured to rotate about a first rotational axis and at least one upper arm rotatably coupled to the at least one lower arm at a second rotational axis that is spaced away from the first rotational axis. The robot apparatus further include a first end effector coupled to the upper arm. The robot apparatus further includes a second end effector coupled to the at least one upper arm. The robot apparatus is suitable for accommodating varying pitches between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/188,374, filed Mar. 1, 2021, the entire content of which is herebyincorporated by reference.

FIELD

Embodiments of the present application relate to robots includingmultiple end effectors and electronic device processing devices andmethods including robots with multiple end effectors.

BACKGROUND

Processing of substrates in semiconductor electronic devicemanufacturing may include a combination of different processes appliedin the same substrate processing system. For example, the processes mayinclude chemical vapor deposition/atomic layer deposition (CVD/ALD) andphysical vapor deposition (PVD) applied within the same tool orplatform. These processes may be applied using different configurationsof processing chambers coupled to a main frame. Robots are located in atransfer chamber of the main frame and are configured to move substratesbetween the various processing chambers.

SUMMARY

In some embodiments, a robot apparatus is provided. The robot apparatusincludes at least one lower arm configured to rotate about a firstrotational axis; at least one upper arm rotatably coupled to the atleast one lower arm at a second rotational axis that is spaced away fromthe first rotational axis; a first end effector rotatably coupled to theat least one upper arm optionally through a first forearm; and a secondend effector rotabably coupled to the at least one upper arm optionallythrough a second forearm. In embodiments, the robot apparatus isconfigured to operate both in a dual substrate handling mode and in asingle substrate handling mode. In the dual substrate handling mode, thefirst end effector and the second end effector are to independentlyrotate about one or more additional rotational axis that are differentfrom the first rotational axis and from the second rotational axis tospace the first end effector from the second end effector by a firstpitch or by a second pitch that is different from the first pitch,wherein at least one of the first pitch or the second pitch is suitablefor the first end effector and the second end effector to concurrentlyaccess separate load lock chambers or separate process chambers. In thesingle substrate handling mode, the first end effector and the secondend effector are to independently rotate about the one or moreadditional rotational axis to align the first end effector and thesecond end effector at a configuration suitable for one of the first endeffector or the second end effector to access one load lock chamber orone process chamber.

In other embodiments, an electronic device processing system isprovided. The electronic device processing system includes a transferchamber; two adjacent load lock chambers coupled to the transferchamber, wherein the two adjacent load lock chambers are horizontallyspaced by a first pitch; four or more process chambers coupled to thetransfer chamber, wherein at least one pair of adjacent process chambersof the four or more process chambers are spaced by a second pitch thatis different from the first pitch; and a robot apparatus at leastpartially located within the transfer chamber. In embodiments, the robotapparatus includes at least one lower arm configured to rotate about afirst rotational axis; at least one upper arm rotatably coupled to theat least one lower arm at a second rotational axis that is spaced awayfrom the first rotational axis; a first end effector rotatably coupledto the at least one upper arm optionally through a first forearm; and asecond end effector rotabably coupled to the at least one upper armoptionally through a second forearm. In embodiments, the robot apparatusis configured to operate both in a dual substrate handling mode and in asingle substrate handling mode. In the dual substrate handling mode, thefirst end effector and the second end effector are to independentlyrotate about one or more additional rotational axis that are differentfrom the first rotational axis and from the second rotational axis tospace the first end effector from the second end effector by the firstpitch or by the second pitch that is different from the first pitch toenable the first end effector and the second end effector toconcurrently access the two adjacent load lock chambers or the at leastone pair of adjacent process chambers. In the single substrate handlingmode, the first end effector and the second end effector are toindependently rotate about the one or more additional rotational axis toalign the first end effector and the second end effector at aconfiguration suitable for one of the first end effector or the secondend effector to access one load lock chamber or one process chamber.

In other embodiments, a method of transferring substrates is provided.The method includes operating a robot apparatus in a dual substratehandling mode and in a single substrate handling mode. In embodiments,the robot apparatus includes at least one lower arm configured to rotateabout a first rotational axis; at least one upper arm rotatably coupledto the at least one lower arm at a second rotational axis that is spacedaway from the first rotational axis; a first end effector rotatablycoupled to the at least one upper arm optionally through a firstforearm; and a second end effector rotabably coupled to the at least oneupper arm optionally through a second forearm. In embodiments, operatingin a dual substrate handling mode includes independently rotating thefirst end effector and the second end effector, about one or moreadditional rotational axis that are different from the first rotationalaxis and from the second rotational axis, to space the first endeffector from the second effector by a first pitch or by a second pitchthat is different from the first pitch, wherein at least one of thefirst pitch or the second pitch is suitable for the first end effectorand the second end effector to concurrently access separate load lockchambers or separate process chambers. In embodiments, operating in asingle substrate handling mode includes independently rotating the firstend effector and the second end effector, about the one or moreadditional rotational axis, to align the first end effector and thesecond end effector in a configuration suitable for one of the first endeffector or the second end effector to access one load lock chamber orone process chamber.

In other embodiments, an electronic device processing system isprovided. The electronic device processing system includes Theelectronic device processing system includes a transfer chamber with acenter; two adjacent loadlock chambers coupled to the transfer chamber,wherein the two adjacent loadlock chambers are horizontally spaced by afirst pitch; four or more process chambers coupled to the transferchamber, wherein at least one pair of adjacent process chambers of thefour or more process chambers are spaced by a second pitch that isdifferent from the first pitch; and a robot apparatus at least partiallylocated within the transfer chamber. In embodiments, the robot apparatusincludes at least one lower arm configured to rotate about a firstrotational axis, wherein the first rotational axis is offset from thecenter of the transfer chamber; at least one upper arm rotatably coupledto the at least one lower arm at a second rotational axis that is spacedaway from the first rotational axis; a first end effector rotatablycoupled to the at least one upper arm optionally through a firstforearm; and a second end effector rotabably coupled to the at least oneupper arm optionally through a second forearm. In embodiments, the robotapparatus is configured to operate in a dual substrate handling mode. Inthe dual substrate handling mode, the first end effector and the secondend effector are to independently rotate about one or more additionalrotational axis that are different from the first rotational axis andfrom the second rotational axis to space the first end effector from thesecond end effector by the first pitch or by the second pitch that isdifferent from the first pitch to enable the first end effector and thesecond end effector to concurrently access the two adjacent load lockchambers or the at least one pair of adjacent process chambers.

Numerous other aspects and features are provided in accordance withthese and other embodiments of the disclosure. Other features andaspects of embodiments of the disclosure will become more fully apparentfrom the following detailed description, the claims, and theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

The drawings, described below, are for illustrative purposes only andare not necessarily drawn to scale. The drawings are not intended tolimit the scope of the disclosure in any way. Wherever possible, thesame or like reference numbers will be used throughout the drawings torefer to the same or like parts.

FIG. 1 illustrates a schematic top view of a substrate processing systemincluding a robot apparatus located in a transfer chamber of a mainframe according to the disclosed embodiments.

FIG. 2A illustrates a perspective view of a robot apparatus according tothe disclosed embodiments.

FIG. 2B illustrates a top view of a robot apparatus according to thedisclosed embodiments.

FIGS. 3A-3D illustrate schematics illustrative of the dual substratehandling mode of the robot apparatus of FIGS. 2A-2B.

FIGS. 4A-4D illustrate schematics illustrative of the single substratehandling mode of the robot apparatus of FIGS. 2A-2B.

FIG. 5A illustrates a perspective view of a robot apparatus according tothe disclosed embodiments.

FIG. 5B illustrates a top view of a robot apparatus according to thedisclosed embodiments.

FIGS. 6A-6D illustrate schematics illustrative of the dual substratehandling mode of the robot apparatus of FIGS. 5A-5B.

FIGS. 7A-7D illustrate schematics illustrative of the single substratehandling mode of the robot apparatus of FIGS. 5A-5B.

FIG. 8A illustrates a perspective view of a robot apparatus according tothe disclosed embodiments.

FIG. 8B illustrates a top view of the robot apparatus of FIG. 8A in afolded configuration (e.g., a chamber preposition or a load lockpreposition).

FIG. 8C illustrates a top view of the robot apparatus of FIG. 8A in anextended configuration (e.g., a twin chamber reach or a dual load lockreach in a dual substrate handling mode).

FIG. 9 illustrates a schematic top view of a substrate processing systemincluding the robot apparatus of FIGS. 8A-8C located in a transferchamber of a main frame according to the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the example embodimentsprovided, which are illustrated in the accompanying drawings. Featuresof the various embodiments described herein may be combined with eachother unless specifically noted otherwise.

Electronic device processing systems may implement a combination ofmultiple substrate manufacturing processes. These substratemanufacturing processes may include chemical vapor deposition/atomiclayer deposition (CVD/ALD) processes, annealing processes, etchprocesses, physical vapor deposition (PVD) and/or other processes. Theelectronic device processing systems may include a variety of differentprocess chambers and load lock chambers to implement the combination ofmultiple substrate manufacturing processes. These process chambers andload lock chambers may each include one or more processing locations onwhich substrates are positioned for processing. Processing locations indifferent process chambers and/or load lock chambers may be separated bydifferent distances (e.g., pitches) depending on a physical arrangementor process chambers, the type of manufacturing process to be implementedwithin each process chamber and/or the configuration of the processchambers.

In embodiments, a transfer chamber includes multiple load locks and/ormultiple process chambers connected to sides or facets of the transferchamber. The transfer chamber may include a robot arm with dual endeffectors for transferring substrates between load locks and/or transferchambers. The robot may by designed such that a pitch or separationbetween the dual end effectors is adjustable, and may be furtherdesigned such that the end effectors may be positioned both for singlesubstrate handling (in which a single substrate is removed from and/orinserted into a process chamber or load lock) and may further bepositioned for multiple substrate handling (in which two substrates areremoved from and/or inserted into a process chamber or load lock).

Existing robot apparatuses, e.g., robot apparatuses with an inline endeffector, access one process chamber and/or one load lock chamber at atime and exhibit throughputs ranging from about 60 wafers per hour (WPH)to about 80 WPH. Thus, in accordance with embodiments described herein,a robot apparatus with enhanced throughput is provided. In certainembodiments, the robot apparatus described herein exhibits a throughputof at least about 100 WPH and in certain embodiments even greater than175 WPH.

A robot apparatus with dual end effectors may be implemented to positionsubstrates on and to remove substrates from multiple processing chambers(e.g., side-by-side process chambers) simultaneously. However, dual endeffectors positioned at a first fixed pitch may not be able to accessone or more process chambers or one or more load lock chambers due tothe process chambers or load lock chambers being separated by a secondfixed pitch that is different from the first fixed pitch. Thus, inaccordance with embodiments described herein, a robot apparatus withvariable end effector pitch is provided.

The robot apparatuses described herein can operate in a single substrateprocessing mode, a dual substrate processing mode, or a combinationthereof. This added flexibility and independent access capabilitypermits sequential loading and unloading of various processing chambersor load lock chambers. This hybrid capability also allows the robotapparatus to continue operating even when one processing chamber or loadlock chamber out of a pair of adjacent processing chambers or load lockchambers is inoperative.

In one or more embodiments described herein, a robot apparatusconfigured to operate in a single substrate mode, dual substrate mode,or a combination thereof is disclosed. The robot apparatus, whenoperating in a dual substrate mode, can have a variable end effectorpitch to accommodate varying pitches, e.g., between two adjacentprocessing chambers or between two adjacent load lock chambers. Incertain embodiments, the robot apparatus is an off-center (also referredto as an off-axis) robot that is positioned off-center from a center ofthe transfer chamber in which it is located.

Example embodiments of robots including different pitches between endeffectors are described herein with reference to FIGS. 1-9.

Reference is now made to FIG. 1, which illustrates a schematic top viewof a substrate processing system 100 including a robot apparatus 102according to disclosed embodiments. The substrate processing system 100may include a main frame 104 including a transfer chamber 106 formed bywalls thereof. The transfer chamber 106 may be configured to operate ina vacuum, for example. The transfer chamber may have a center 150. Therobot apparatus 102 may be at least partially located in the transferchamber 106 and may be configured to be operable therein. The robotapparatus 102 may include a body (214 in FIG. 2, 514 in FIGS. 5, and 814in FIG. 8A) that is configured to be attached to a wall (e.g., thefloor) of the transfer chamber 106. The robot apparatus 102 may be “offaxis” or “off center,” which as used herein, refers to the robotapparatus having at least one lower arm configured to rotate about afirst rotational axis that is offset from the center 150 of the transferchamber 106.

The robot apparatus 102 may be configured to pick and/or placesubstrates 118 (sometimes referred to as a “wafers” or “semiconductorwafers”) to and from different destinations. The destinations may beprocess chambers coupled to the transfer chamber 106. The destinationsmay also be load lock chambers coupled to transfer chamber 106. Forexample, the destinations may be one or more process chambers 120 andone or more load lock chambers 122 that may be coupled to transferchamber 106. The main frame 104 may include more or fewer processchambers 120 than illustrated in FIG. 1 and more or fewer load lockapparatus 122 than illustrated in FIG. 1.

The process chambers 120 may be configured to carry out any number ofprocess steps on the substrates 118, such as deposition, oxidation,nitration, etching, polishing, cleaning, lithography, or the like. InFIG. 1, seven process chambers 120 are shown coupled to various sides oftransfer chamber 106. However, it should be noted that otherconfigurations that include more or fewer process chambers are alsofeasible and contemplated by the instant disclosure. In certainembodiments, the number of process chambers coupled to the transferchamber 106 ranges from 4 to 24. In certain embodiments, the number ofprocess chambers coupled to the transfer chamber 106 ranges from 4 to20. In certain embodiments, the number of process chambers coupled tothe transfer chamber 106 ranges from 5 to 16. In certain embodiments,the number of process chambers coupled to the transfer chamber 106ranges from 6 to 10. FIG. 9 depicts an example with of an electronicdevice processing system with 12 process chambers. In some embodiments,the transfer chamber is a linear transfer chamber having two longersides and two shorter sides. In other embodiments, the transfer chambermay have more than four sides, such as five sides, six sides, sevensides, eight sides, and so on. The multiple sides may have a same size(e.g., a same length) and/or different sizes.

The load lock chambers 122 may be configured to interface with a factoryinterface 126. The factory interface 126 may include a load/unload robot127 (shown as a dotted box) configured to transport substrates 118 toand from substrate carriers 128 (e.g., Front Opening Unified Pods(FOUPs)) docked at load ports 130 of the factory interface 126. Anotherload/unload robot may transfer the substrates 118 between the substratecarriers 128 and the load lock chambers 122 in any sequence or order.

In some embodiments, two adjacent load lock chambers 122 arehorizontally spaced by a first pitch D1. In some embodiments, the firstpitch D1 between centers of the two adjacent load lock chambers 122 maybe in a range of about 20 inches to about 25 inches. In someembodiments, the first pitch D1 between centers of two adjacent loadlock chambers 122 may be in a range of about 21 inches to about 23inches. In some embodiments, the first pitch D1 between centers of twoadjacent load lock chambers 122 may be about 22 inches. Other distancesfor the first pitch D1 may also be possible.

In some embodiments, at least one pair of two adjacent process chambers120 are horizontally spaced by a second pitch D2 that is different fromthe first pitch D1 (e.g., second pitch D2 may be greater than firstpitch D1). In some embodiments, the second pitch D2 between centers ofthe two adjacent process chambers 120 may be in a range of about 32inches to about 40 inches. In some embodiments, the second pitch D2between centers of two adjacent process chambers 120 may be in a rangeof about 34 inches to about 38 inches. In some embodiments, the secondpitch D2 between centers of two adjacent process chambers 120 may beabout 36 inches. Other distances for the second pitch D2 may also bepossible.

One or more of the load lock chambers 122 may be accessed by the robotapparatus 102 through slit valves 134. One or more of the processchambers 120 may be accessed by the robot apparatus 102 through slitvalves 140.

A robot apparatus according to embodiments described herein includes atleast one lower arm configured to rotate about a first rotational axis;at least one upper arm coupled to the at least one lower arm at a secondrotational axis that is spaced away from the first rotational axis; afirst end effector rotatably coupled to the at least one upper armoptionally through a first forearm; and a second end effector rotatablycoupled to the at least one upper arm optionally through a secondforearm. In certain embodiments, the first end effector and the secondend effector of robot apparatus 102 are co-planar.

The slit valves 134 and 140 may have a slit valve width that allows therobot apparatus 102, and particularly, the first end effector and thesecond end effector, to access them in both, dual substrate handlingmode and in single substrate handling mode. In certain embodiments, thefirst end effector and/or the second end effector access the slitvalve(s) 134 and/or slit valve(s) 140 orthogonally (relative to thehorizontal opening of slit valve 134 or of slit valve 140). Inalternative embodiments, the first end effector and/or the second endeffector access the slit valve(s) 134 and/or the slit valve(s) 140 at anangle (relative to the horizontal center line of slit valve 134 or ofslit valve 140). The first and/or the second end effector(s) may accessone or more of slit valve(s) 134 and/or 140 at an angle ranging fromabout 0° to about 20°, from about 5° C. to about 17°, or from about 7°to about 14° relative, when measured relative to the horizontal centerline of slit valve 134 or of slit valve 140.

“Dual substrate handling mode,” as used herein refers to the robotapparatus 102 concurrently accessing two adjacent load lock chambers(e.g., load lock chambers 122) or at least one pair of adjacent processchambers (e.g., process chambers 120). When the robot apparatus 102 isin dual substrate handling mode, the first end effector and the secondend effector are to independently or jointly rotate about one or moreadditional axis that are different from the first rotational axis andfrom the second rotational axis to space the first end effector from thesecond end effector by the first pitch D1 or by the second pitch D2.

“Single substrate handling mode,” as used herein refers to the robotapparatus accessing one load lock chamber (e.g., load lock chamber 122)or one process chamber (e.g., process chamber 120). When the robotapparatus 102 is in single substrate handling mode, the first endeffector and the second end effector are to independently rotate aboutone or more additional axis that are different from the first rotationalaxis and from the second rotational axis to align the first end effectorand the second end effector at a configuration suitable for one of thefirst end effector or the second end effector to access one load lockchamber or one process chamber. The second end effector that is notbeing used to pick or place a substrate may be rotated out of the way sothat it does not interfere with picking or placing of the substrate bythe first end effector that is performing picking and placing of asubstrate.

The term “access,” as used herein with reference to the one or more ofthe end effectors accessing one or more load lock chamber(s) and/orprocess chamber(s) refers to the end effector(s) accessing said chamberto pick up substrate(s), drop off substrate(s), exchange substrate(s),and/or any other operation those skilled in the art would understand tobe performed by end effectors accessing a load lock chamber(s) and/or aprocess chamber(s).

Various embodiments of robot apparatus 102 are contemplated herein, aswill be illustrated in further detail with respect to FIGS. 2A-2B,5A-5B, and 8A-8C. The mode of operation for dual substrate handling modeand single substrate handling mode may vary for different embodiments ofrobot apparatus 102, as will be illustrated in further detail withrespect to FIGS. 3A-3D, 4A-4D, 6A-6D, and 7A-7D.

A controller 142 may be in communication with the robot apparatus 102.The robot apparatus 102 may be controlled by suitable commands from thecontroller 142. The controller 142 may also control the slit valves 134and 140 and other components and processes taking place within the mainframe 104, load lock chambers 122, and processing chambers 120.

Additional reference is made to FIG. 2A, which illustrates a perspectiveview of an embodiment of the robot apparatus 102 according to disclosedembodiments, and to FIG. 2B which illustrates a top view of the robotapparatus 102 according to disclosed embodiments. In the embodimentshown in FIGS. 2A-2B, robot apparatus 102A is illustrated. The robotapparatus 102A may include one lower arm 210 configured to rotate aboutthe first rotational axis 215. For example, one or more motors (notshown) located in the base 214 may rotate the one lower arm 210 aboutthe first rotational axis 215. The robot apparatus 102A may furtherinclude one upper arm 220 rotatably coupled to the one lower arm 210 ata second rotational axis 225 that is spaced away from the firstrotational axis 215. Upper arm 220 may be configured to rotate about thesecond rotational axis 225. For example, one or more motors (not shown)located in the base 214 may rotate the one upper arm 220 about thesecond rotational axis 225. In some embodiments, portions of the lowerarm 210 and portions of the upper arm 220 may operate on differentplanes, one above the other.

The robot apparatus 102A may further include a first end effector 230Athat is rotatably coupled to the one upper arm 220 at a third rotationalaxis 235 spaced from the second rotational axis 225. The first endeffector may include a first bend 232A in a first direction within ahorizontal plane. The robot apparatus 102A may also include a second endeffector 230B that is rotatably coupled to the one upper arm 220 at thethird rotational axis 235. The second end effector may include a secondbend 232B in a second direction within a horizontal plane, wherein thesecond direction is opposite the first direction. The first end effector230A and the second end effector 230B may be configured to rotateindependently about the third rotational axis 235 for both, the dualsubstrate handling mode and the single substrate handling mode. Forexample, one or more motors (not shown) located in the base 214 mayindependently rotate the first end effector 230A and second end effector230B about the third rotational axis 235 or both, the dual substratehandling mode and the single substrate handling mode.

In certain embodiments, the instant disclosure encompasses a method oftransferring substrates by operating a robot apparatus in a dualsubstrate handling mode and in a single substrate handling mode. Theoperation of robot apparatus 102A in a dual substrate handling mode isfurther described with reference to FIGS. 3A-3D.

In FIG. 3A, robot apparatus 102A, as described with respect to FIGS.2A-2B, is shown in an extended configuration suitable for reaching into(or accessing) two horizontally adjacent load lock chambers (such asload lock chambers 122 from FIG. 1). This configuration will be referredto herein as “dual load lock reach.” The first end effector 230A and thesecond end effector 230B may be independently rotated about thirdrotational axis 235 to arrive at the dual load lock reach where the twoend effectors are spaced by a first pitch. As can be seen in FIG. 3A, indual load lock reach, the first end effector 230A is spaced from thesecond end effector 230B by a first pitch D1. In some embodiments, thefirst pitch D1 is measured between a first end point 232A of the firstend effector 230A and a second end point 232B of the second end effector230B, as shown in the FIG. 3A configuration, and said first pitch D1corresponds to the distance between the centers of two horizontallyadjacent load locks 122. In some embodiments, the first pitch D1 betweencenters of the two adjacent load lock chambers 122 may be in a range ofabout 20 inches to about 25 inches. In some embodiments, the first pitchD1 between centers of two adjacent load lock chambers 122 may be in arange of about 21 inches to about 23 inches. In some embodiments, thefirst pitch D1 between centers of two adjacent load lock chambers 122may be about 22 inches. Other distances for the first pitch D1 may alsobe possible.

In certain embodiments, the first end effector 230A and the second endeffector 230B access both slit valves 134 of load lock chambers 122concurrently and at an angle (relative to the horizontal center line ofslit valve 134 or of slit valve 140), as shown in FIG. 3A. In certainembodiments (not shown), the first end effector 230A and the second endeffector 230B access both slit valves 134 concurrently and orthogonally(relative to the horizontal opening of slit valve 134 or of slit valve140).

In the dual load lock reach, robot apparatus 102A can access both loadlock chambers 122 to retrieve two substrates 118 to transfer them to twoprocess chambers 120 or to place processed substrates thereon to betransferred out of the main frame 104.

To further describe the dual substrate handling mode, it will be assumedthat robot apparatus 102A retrieves two substrates 118 from load lockchambers 122 to transfer them to two horizontally adjacent processchambers 120. Upon retrieval of the two substrates, the robot apparatus102A swivels within transfer chamber 106 to arrive at a “chamberpreposition” alignment (FIG. 3B) in which the first end effector 230Aand the second end effector 230B may be rotated, about the thirdrotational axis 235, into a position suitable for accessing twohorizontally adjacent process chambers 120. Swiveling may involve one ormore of: rotating the lower arm 210 about first rotational axis 215,rotating upper arm 220 about second rotational axis 225, and/or rotatingone or more of the first end effector 230A or the second end effector230B, independently, about the third rotational axis 235.

Upon reaching the “chamber preposition” alignment, the first endeffector 230A and second end effector 230B may be further separated by asecond pitch D2. The first end effector 230A and the second end effector230B may be independently rotated about third rotational axis 235 toarrive at the dual process chamber reach where the two end effectors arespaced by a second pitch. In some embodiments, the second pitch D2 ismeasured between a first end point 232A of the first end effector 230Aand a second end point 232B of the second end effector 230B, as shown inthe FIG. 3C configuration, and said second pitch D2 corresponds to thedistance between the centers of two horizontally adjacent processchambers 120. In some embodiments, the second pitch D2 between centersof the two adjacent process chambers 120 may be in a range of about 32inches to about 40 inches. In some embodiments, the second pitch D2between centers of two adjacent process chambers 120 may be in a rangeof about 34 inches to about 38 inches. In some embodiments, the secondpitch D2 between centers of two adjacent process chambers 120 may beabout 36 inches. Other distances for the second pitch D2 may also bepossible.

In certain embodiments (not shown), the first end effector 230A and thesecond end effector 230B access both slit valves 140 of two horizontallyadjacent process chambers 120 concurrently and at an angle (relative tothe horizontal center line of slit valve 140). In certain embodiments,the first end effector 230A and the second end effector 230B access bothslit valves 140 of two horizontally adjacent process chambers 120concurrently and orthogonally (relative to the horizontal opening ofslit valve 140), as shown in FIG. 3C.

In FIG. 3C, robot apparatus 102A is shown in an extended configurationsuitable for reaching into (or accessing) two horizontally adjacentprocess chambers (such as process chambers 120 from FIG. 1). Thisconfiguration will be referred to herein as “dual process chamberreach.” As can be seen in FIG. 3C, in the dual process chamber reach,the first end effector 230A is spaced from the second end effector 230Bby the second pitch D2. In the dual process chamber reach, robotapparatus 102A can access two adjacent process chambers 120 to place twosubstrates 118 for processing (or to retrieve processed substrates totransfer them for further processing or to the load lock chambers 122).

After processing, robot 102A may retrieve processed substrates from apair of horizontally adjacent process chambers 120 in the “dual processchamber reach” configuration, swivel within transfer chamber 106, andarrive at a “loadlock preposition” alignment, as shown in FIG. 3D.Swiveling may involve one or more of: rotating the lower arm 210 aboutfirst rotational axis 215, rotating upper arm 220 about secondrotational axis 225, and/or rotating one or more of the first endeffector 230A or the second end effector 230B, independently, about thethird rotational axis 235. Upon reaching the “loadlock preposition”alignment shown in FIG. 3D, robot apparatus 102A may repeat operations3A through 3D cyclically to sequentially load and/or unload processchambers 120 and load lock chambers 122 in electronic device processingsystem 100.

The operation of robot apparatus 102A in a single substrate handlingmode is further described with reference to FIGS. 4A-4D.

In FIG. 4A, robot apparatus 102A, is shown in the “dual load lockreach,” as explained with respect to FIG. 3A. In the dual load lockreach, robot apparatus 102A can access both load lock chambers 122 toretrieve two substrates 118, which can then be concurrently placed intwo horizontally adjacent process chambers 120 as shown with respect toFIGS. 3B-3C. Alternatively, the two substrates 118 may be sequentiallyunloaded into two process chambers (which may or may not be horizontallyadjacent), as shown with respect to FIGS. 4B-4C.

Although not shown in the figures, robot apparatus 102A can also accessone load lock chamber 122 to retrieve a single substrate 118 at a time.This may be useful to continue operation of the electronic deviceprocessing system when, for example, one load lock chamber is out ofrepair. For instance, end effector 230A could access either one of loadlock chambers 122 without accessing the other. Similarly, end effector230B could access either one of load lock chambers 122 without accessingthe other. Doing so would involve independently rotating the first endeffector 230A and the second end effector 230B about the thirdrotational axis 235 to align the first end effector 230A and the secondend effector 230B in a configuration suitable for one of the first endeffector 230A or the second end effector 230B to access one load lockchamber 122. In certain embodiments, slits valves 134 of load lockchambers 122 may have a width suitable for accommodating access of thefirst end effector 230A and/or the second end effector 230B, whetherboth are accessing two load lock chamber concurrently or one load lockchamber sequentially.

The angle at which the first end effector and/or the second end effectorwould access one or more load lock chambers may also vary depending onwhether two load lock chambers are accessed concurrently or one loadlock chamber is accessed sequentially by both end effectors. In certainembodiments, the first end effector 230A and the second end effector230B access both slit valves 134 concurrently and orthogonally (relativeto the horizontal opening of slit valve 134). In certain embodiments,the first end effector 230A and the second end effector 230B access bothslit valves 134 concurrently and at an angle (relative to the horizontalcenter line of slit valve 134). In certain embodiments, the first endeffector 230A and/or the second end effector 230B access the slit valve134 of a single load lock chamber sequentially and orthogonally(relative to the horizontal opening of slit valve 134). In certainembodiments, the first end effector 230A and/or the second end effector230B access the slit valve 134 of a single load lock chambersequentially and at an angle (relative to the horizontal center line ofslit valve 134).

In FIGS. 4B and 4C, the first end effector 230A and the second endeffector 230B independently rotate about the third rotational axis 235to align the first end effector 230A and the second end effector 230B ina configuration suitable for one of the first end effector 230A or thesecond end effector 230B to access one process chamber 120. For example,in FIG. 4B, first end effector 230A unloads a substrate into one processchamber and thereafter second end effector 230B unloads a substrate intoanother process chamber (positioned on the opposite side of the processchamber that received the substrate from first end effector 230A).

In FIG. 4C, the first end effector 230A and the second end effector 230Bindependently rotate about the third rotational axis 235 to align thefirst end effector 230A and the second end effector 230B in aconfiguration suitable for one of the first end effector 230A or thesecond end effector 230B to access one process chamber 120.

In certain embodiments, the first end effector 230A and the second endeffector 230B can sequentially access one slit valve 140 of the sameprocess chamber 120 or of two separate process chambers 120 (that may ormay not be in horizontally adjacent locations). In certain embodiments(not shown), the first end effector 230A and/or the second end effector230B access a given slit valve 140 at an angle (relative to thehorizontal center line of slit valve 140). In certain embodiments, thefirst end effector 230A and/or the second end effector 230B access aslit valve 140 of a process chamber chamber orthogonally (relative tothe horizontal opening of slit valve 140), as shown in FIGS. 4B and 4C.

After processing, robot 102A may retrieve processed substratessequentially with the “single process chamber reach” configurationsshown in FIGS. 4B-4C, swivel within transfer chamber 106, and arrive ata “loadlock preposition” alignment, as shown in FIG. 4D. Swiveling mayinvolve one or more of: rotating the lower arm 210 about firstrotational axis 215, rotating upper arm 220 about second rotational axis225, and/or rotating one or more of the first end effector 230A or thesecond end effector 230B, independently, about the third rotational axis235. Upon reaching the “loadlock preposition” alignment shown in FIG.4D, robot apparatus 102A may repeat operations 4A through 4D cyclicallyto sequentially load and/or unload process chambers 120 and load lockchambers 122 in electronic device processing system 100.

Robot apparatus 102A may also use a combination of dual substrateoperation mode, in accordance with FIGS. 3A-3D, and single substrateoperation mode, in accordance with FIGS. 4A-4D, to load and/or unloadprocess chambers 120 and load lock chambers 122 in electronic deviceprocessing system 100.

For instance, in an electronic device processing system with six processchambers 120 (three on a first side and three on a second side that isopposite the first side), robot apparatus 102A may load substrates intothe six process chambers in three runs, as follows: 1) dual substrateoperation mode to concurrently load two substrates into one pair ofhorizontally adjacent process chambers on the first side (e.g., processchambers 120A and 120B); 2) dual substrate operation mode toconcurrently load two substrates into one pair of horizontally adjacentprocess chambers on the second side (e.g., process chambers 120E and120F); 3) single substrate operation mode to sequentially load onesubstrate into the remaining empty process chamber on the first side(e.g., process chamber 120C) followed by loading one substrate into theremaining empty process chamber on the second side (e.g., processchamber 120D). A similar sequence may be used to unload the sameexemplary electronic device processing system. A similar sequence withmore or fewer runs may also be implemented for other electronic deviceprocessing systems with more or fewer process chambers.

The sequence illustrated herein should not be construed as limiting. Forinstance, process chambers 120B and 120C may be loaded concurrently,process chambers 120D and 120E may be loaded concurrently, and processchambers 120A and 120F may be loaded sequentially. In anotherembodiment, process chambers 120A and 120B may be loaded concurrently,process chambers 120D and 120E may be loaded concurrently, and processchambers 120C and 120F may be loaded sequentially. In yet anotherembodiment, process chambers 120B and 120C may be loaded concurrently,process chambers 120E and 120F may be loaded concurrently, and processchambers 120A and 120D may be loaded sequentially. The order of loadingand unloading the process chambers should also not be construed aslimiting.

In another example, in an electronic device processing system with sixprocess chambers 120 (three on a first side and three on a second sidethat is opposite the first side) with one operational load lock chamber(e.g., 122A), robot apparatus 102A may operate according to thefollowing sequence: 1) single substrate operation mode to pick up onesubstrate from load lock chamber 122A with second end effector 230B; 2)single substrate operation mode to pick up a second substrate from loadlock chamber 122A with first end effector 230A; 3) dual substrateoperation mode to concurrently load two substrates into one pair ofhorizontally adjacent process chambers, or single substrate operationmode to sequentially load one substrate one process chamber followed byloading the second substrate into another process chamber; 4)repeating 1) through 3) until the electronic device processing system isfully loaded. A similar sequence may be used to unload the sameexemplary electronic device processing system. A similar sequence withmore or fewer runs may also be implemented for other electronic deviceprocessing systems with more or fewer process chambers. A similarsequence may also be used when the one operational load lock chamber isload lock chamber 122B.

Additional reference is made to FIG. 5A, which illustrates a perspectiveview of an embodiment of the robot apparatus 102 according to disclosedembodiments, and to FIG. 5B which illustrates a top view of the robotapparatus 102 according to disclosed embodiments. In the embodimentshown in FIGS. 5A-5B, robot apparatus 102B is illustrated. The robotapparatus 102B may include one lower arm 510 configured to rotate aboutthe first rotational axis 515. For example, one or more motors (notshown) located in the base 514 may rotate the one lower arm 510 aboutthe first rotational axis 515. The robot apparatus 102B may furtherinclude one upper arm 520 rotatably coupled to the one lower arm 510 ata second rotational axis 525 that is spaced away from the firstrotational axis 515. Upper arm 520 may be configured to rotate about thesecond rotational axis 525. For example, one or more motors (not shown)located in the base 514 may rotate the one upper arm 520 about thesecond rotational axis 525. In some embodiments, portions of the lowerarm 510 and portions of the upper arm 520 may operate on differentplanes, one above the other.

The robot apparatus 102B may further include a first forearm 530A and asecond forearm 530B, that are each rotatably coupled to the one upperarm 520 at a third rotational axis 535 spaced from the second rotationalaxis 525. The first forearm 530A and the second forearm 530B may beconfigured to rotate independently about the third rotational axis 535for both, the dual substrate handling mode and the single substratehandling mode. For example, one or more motors (not shown) located inthe base 514 may independently rotate the first forearm 530A and secondforearm 530B about the third rotational axis 535 for both, the dualsubstrate handling mode and the single substrate handling mode.

The robot apparatus 102B may further include a first end effector 540Athat is rotatably coupled to the first forearm 530A at a fourthrotational axis 545 spaced from the third rotational axis 535. The robotapparatus 102B may also include a second end effector 540B that isrotatably coupled to the second forearm 530B at a fifth rotational axis555 spaced from the third rotational axis 535 and separate from thefourth rotational axis 545.

The first forearm 530A, the second forearm 530B, the first end effector540A, and the second end effector 540B may be configured to rotateindependently about the third rotational axis 535, the fourth rotationalaxis 545, and the fifth rotational axis 555, for both, the dualsubstrate handling mode and the single substrate handling mode. Forexample, one or more motors (not shown) located in the base 514 mayindependently rotate the first forearm 530A and the second forearm 530Babout the third rotational axis 535, the first end effector 540A aboutthe fourth rotational axis 545, and the second end effector 540B aboutthe fifth rotational axis 555 for both, the dual substrate handling modeand the single substrate handling mode.

In an alternative embodiment, rather than a motor controlling one ormore constituents of robot apparatus 102B, a cam pulley design or acombination of a cam pulley design and one or more motors may be used tocontrol one or more constituents of robot apparatus 102B. For example,one motor (not shown) located in base 514 may be configured toindependently rotate lower arm 510 about first rotational axis 515, onemotor (not shown) located in base 514 may be configured to independentlyrotate upper arm 520 about second rotational axis 525, two motors (notshown) located in base 514 may be configured to independently rotatefirst forearm 530A and second forearm 530B about the third rotationalaxis 535, and a cam pulley design (not shown) may be configured tocontrol the first forearm 530A, the second forearm 530B, the first endeffector 540A, and the second end effector 540B to space the second endeffector 540B from the first end effector 540A by a first pitch D1 or bya second pitch D2.

The operation of robot apparatus 102B in a dual substrate handling modeis further described with reference to FIGS. 6A-6D.

In FIG. 6A, robot apparatus 102B, as described with respect to FIGS.5A-5B, is shown in an extended configuration suitable for reaching into(or accessing) two horizontally adjacent load lock chambers (such asload lock chambers 122 from FIG. 1). This configuration will be referredto herein as “dual load lock reach.” The first forearm 530A and thesecond forearm 530B may be independently rotated about third rotationalaxis 535, the first end effector 540A may be independently rotated aboutfourth rotational axis 545, and the second end effector 540B may beindependently rotated about fifth rotational axis 555, to arrive at thedual load lock reach where the two end effectors are spaced by a firstpitch. As can be seen in FIG. 6A, in dual load lock reach, the first endeffector 540A is spaced from the second end effector 540B by a firstpitch D1. In some embodiments, the first pitch D1 is measured between afirst end point 542A of the first end effector 540A and a second endpoint 542B of the second end effector 540B, as shown in the FIG. 6Aconfiguration, and said first pitch D1 corresponds to the distancebetween the centers of two horizontally adjacent load lock chambers 122.In some embodiments, the first pitch D1 between centers of the twoadjacent load lock chambers 122 may be in a range of about 20 inches toabout 25 inches. In some embodiments, the first pitch D1 between centersof two adjacent load lock chambers 122 may be in a range of about 21inches to about 23 inches. In some embodiments, the first pitch D1between centers of two adjacent load lock chambers 122 may be about 22inches. Other distances for the first pitch D1 may also be possible.

In the dual load lock reach, robot apparatus 102B can access both loadlock chambers 122 to retrieve two substrates 118 to transfer them to twoprocess chambers 120 or to place processed substrates thereon to betransferred out of the main frame 104.

To further describe the dual substrate handling mode, it will be assumedthat robot apparatus 102B retrieves two substrates 118 from load lockchambers 122 to transfer them to two horizontally adjacent processchambers 120. Upon retrieval of the two substrates, the robot apparatus102B rotates (and/or contracts) the first forearm 530A, the secondforearm 530B, the first end effector 540A, and the second end effector540B, and swivels within transfer chamber 106 to arrive at a “chamberpreposition” alignment, which in this embodiment may also be referred toas ““W” shape preposition” alignment (FIG. 6B). In the “W” shapepreposition alignment, the first forearm 530A, the second forearm 530B,the first end effector 540A, and the second end effector 540B may berotated about their corresponding rotational axis into a positionsuitable for accessing two horizontally adjacent process chambers 120.Swiveling may involve one or more of: rotating the lower arm 510 aboutfirst rotational axis 515; rotating upper arm 520 about secondrotational axis 525; rotating one or more of the first forearm 530A orthe second forearm 530B, independently, about the third rotational axis535; rotating the first end effector 540A about fourth rotational axis545; and/or rotating the second end effector about fifth rotational axis555.

Upon reaching the “chamber preposition” alignment or ““W” shapepreposition” alignment and swiveling into a direction suitable forprocess chamber reach, the first end effector 540A and second endeffector 540B may be further separated by a second pitch D2. The firstforearm 530A and the second forearm 530B may be independently rotatedabout third rotational axis 535, the first end effector 540A may beindependently rotated about a fourth rotational axis 545, and the secondend effector 540B may be independently rotated about a fifth rotationalaxis 555, to arrive at the dual process chamber reach where the two endeffectors are spaced by a second pitch. In some embodiments, the secondpitch D2 is measured between a first end point 542A of the first endeffector 540A and a second end point 542B of the second end effector540B, as shown in the FIG. 6C configuration, and said second pitch D2corresponds to the distance between the centers of two horizontallyadjacent process chambers 120. In some embodiments, the second pitch D2between centers of the two adjacent process chambers 120 may be in arange of about 32 inches to about 40 inches. In some embodiments, thesecond pitch D2 between centers of two adjacent process chambers 120 maybe in a range of about 34 inches to about 38 inches. In someembodiments, the second pitch D2 between centers of two adjacent processchambers 120 may be about 36 inches. Other distances for the secondpitch D2 may also be possible.

In FIG. 6C, robot apparatus 102B is shown in an extended configurationsuitable for reaching into (or accessing) two horizontally adjacentprocess chambers (such as process chambers 120 from FIG. 1). Thisconfiguration will be referred to herein as “dual process chamberreach.” As can be seen in FIG. 6C, in the dual process chamber reach,the first end effector 540A is spaced from the second end effector 540Bby the second pitch D2. In the dual process chamber reach, robotapparatus 102B can concurrently access two adjacent process chambers 120to place two substrates 118 for processing (or to retrieve processedsubstrates to transfer them for further processing or to the load lockchambers 122).

After processing, robot 102B may retrieve concurrently processedsubstrates from a pair of horizontally adjacent process chambers 120 inthe “dual process chamber reach” configuration, swivel within transferchamber 106, and arrive at a “loadlock preposition” alignment which mayalso be referred to as ““V” shape preposition” alignment, as shown inFIG. 6D. Swiveling may involve one or more of: rotating the lower arm510 about first rotational axis 515; rotating upper arm 520 about secondrotational axis 525; rotating one or more of the first forearm 530A orthe second forearm 530B, independently, about the third rotational axis535; rotating the first end effector 540A about fourth rotational axis545; and/or rotating the second end effector about fifth rotational axis555. Upon reaching the “loadlock preposition” alignment shown in FIG.6D, robot apparatus 102B may repeat operations 6A through 6D cyclicallyto sequentially load and/or unload process chambers 120 and load lockchambers 122 in electronic device processing system 100.

The operation of robot apparatus 102B in a single substrate handlingmode is further described with reference to FIGS. 7A-7D.

In FIG. 7A, robot apparatus 102B, is shown in the “dual load lockreach,” as explained with respect to FIG. 6A. In the dual load lockreach, robot apparatus 102B can access both load lock chambers 122 toretrieve two substrates 118, which can then be concurrently placed intwo horizontally adjacent process chambers 120 as shown with respect toFIGS. 6B-6C. Alternatively, the two substrates 118 may be sequentiallyunloaded into two process chambers (which may or may not be horizontallyadjacent), as shown with respect to FIGS. 7B-7C.

Although not shown in the figures, robot apparatus 102B can also accessone load lock chamber 122 to retrieve a single substrate 118 at a time.This may be useful to continue operation of the electronic deviceprocessing system when, for example, one load lock chamber is out ofrepair. For instance, end effector 540A could access either one of loadlock chambers 122 without accessing the other. Similarly, end effector540B could access either one of load lock chambers 122 without accessingthe other. Doing so would involve independently rotating the firstforearm 530A and the second forearm 530B independently rotate about thethird rotational axis 535, the first end effector 540A independentlyrotates about the fourth rotational axis 545, and the second endeffector 540B independently rotates about the fifth rotational axis 555,to align the first end effector 540A and the second end effector 540B ina configuration suitable for one of the first end effector 540A or thesecond end effector 540B to access one load lock chamber 122. In certainembodiments, slits valves 134 of load lock chambers 122 may have a widthsuitable for accommodating access of the first end effector 540A and/orthe second end effector 540B, whether both are accessing two load lockchamber concurrently or one load lock chamber sequentially.

In FIGS. 7B and 7C, the first forearm 530A and the second forearm 530Bindependently rotate about the third rotational axis 535, the first endeffector 540A independently rotates about the fourth rotational axis545, and the second end effector 540B independently rotates about thefifth rotational axis 555, to align the first end effector 540A and thesecond end effector 540B in a configuration suitable for one of thefirst end effector 540A or the second end effector 540B to access oneprocess chamber 120. For example, in FIG. 7B, first end effector 540Aunloads a substrate into one process chamber and thereafter, in FIG. 7C,second end effector 540B unloads a substrate into another processchamber (positioned on the opposite side of the process chamber thatreceived the substrate from first end effector 540A).

After processing, robot 102B may retrieve processed substratessequentially with the “single process chamber reach” configurationsshown in FIGS. 7B-7C, swivel within transfer chamber 106, and arrive ata “loadlock preposition” alignment which may also be referred to as ““V”shape preposition” alignment, as shown in FIG. 7D. Swiveling may involveone or more of: rotating the lower arm 510 about first rotational axis515; rotating upper arm 520 about second rotational axis 525; rotatingone or more of the first forearm 530A or the second forearm 530B,independently, about the third rotational axis 535; rotating the firstend effector 540A about fourth rotational axis 545; and/or rotating thesecond end effector about fifth rotational axis 555. Upon reaching the“loadlock preposition” alignment or “V” shape preposition alignmentshown in FIG. 7D, robot apparatus 102B may repeat operations 7A through7D cyclically to sequentially load and/or unload process chambers 120and load lock chambers 122 in electronic device processing system 100.

Robot apparatus 102B may also use a combination of dual substrateoperation mode, in accordance with FIGS. 6A-6D, and single substrateoperation mode, in accordance with FIGS. 7A-7D, to load and/or unloadprocess chambers 120 and load lock chambers 122 in electronic deviceprocessing system 100.

For instance, in an electronic device processing system with six processchambers 120 (three on a first side and three on a second side that isopposite the first side), robot apparatus 102B may load substrates intothe six process chambers in three runs, as follows: 1) dual substrateoperation mode to concurrently load two substrates into one pair ofhorizontally adjacent process chambers on the first side (e.g., processchambers 120A and 120B); 2) dual substrate operation mode toconcurrently load two substrates into one pair of horizontally adjacentprocess chambers on the second side (e.g., process chambers 120E and120F); 3) single substrate operation mode to sequentially load onesubstrate into the remaining empty process chamber on the first side(e.g., process chamber 120C) followed by loading one substrate into theremaining empty process chamber on the second side (e.g., processchamber 120D). A similar sequence may be used to unload the sameexemplary electronic device processing system. A similar sequence withmore or fewer runs may also be implemented for other electronic deviceprocessing systems with more or fewer process chambers.

The sequence illustrated herein should not be construed as limiting. Forinstance, process chambers 120B and 120C may be loaded concurrently,process chambers 120D and 120E may be loaded concurrently, and processchambers 120A and 120F may be loaded sequentially. In anotherembodiment, process chambers 120A and 120B may be loaded concurrently,process chambers 120D and 120E may be loaded concurrently, and processchambers 120C and 120F may be loaded sequentially. In yet anotherembodiment, process chambers 120B and 120C may be loaded concurrently,process chambers 120E and 120F may be loaded concurrently, and processchambers 120A and 120D may be loaded sequentially. The order of loadingand unloading the process chambers should also not be construed aslimiting.

In another example, in an electronic device processing system with sixprocess chambers 120 (three on a first side and three on a second sidethat is opposite the first side) with one operational load lock chamber(e.g., 122A), robot apparatus 102B may operate according to thefollowing sequence: 1) single substrate operation mode to pick up onesubstrate from load lock chamber 122A with second end effector 540B; 2)single substrate operation mode to pick up a second substrate from loadlock chamber 122A with first end effector 540A; 3) dual substrateoperation mode to concurrently load two substrates into one pair ofhorizontally adjacent process chambers, or single substrate operationmode to sequentially load one substrate one process chamber followed byloading the second substrate into another process chamber; 4)repeating 1) through 3) until the electronic device processing system isfully loaded. A similar sequence may be used to unload the sameexemplary electronic device processing system. A similar sequence withmore or fewer runs may also be implemented for other electronic deviceprocessing systems with more or fewer process chambers. A similarsequence may also be used when the one operational load lock chamber isload lock chamber 122B.

Additional reference is made to FIG. 8A, which illustrates a perspectiveview of an embodiment of the robot apparatus 102 according to disclosedembodiments, to FIG. 8B which illustrates a top view of the robotapparatus 102 in a contracted (or folded) configuration according todisclosed embodiments, and to FIG. 8C which illustrates a top view ofthe robot apparatus 102 in an extended configuration according todisclosed embodiments. In the embodiment shown in FIGS. 8A-8C, robotapparatus 102C is illustrated. The robot apparatus 102C may include abody 814 mounted on a linear track 816. The body 814 may be configuredto move along the linear track 816.

Robot apparatus 102C may further include a first lower arm 810A,configured to rotate about the first rotational axis 815, and a secondlower arm 810B, configured to rotate about the first rotational axis815. For example, one or more motors (not shown) located in the base 814may independently rotate the first lower arm 810A and/or the secondlower arm 810B about the first rotational axis 815.

The robot apparatus 102C may further include a first upper arm 820Arotatably coupled to the first lower arm 810A at a second rotationalaxis 825 that is spaced away from the first rotational axis 815. Firstupper arm 820A may be configured to rotate about the second rotationalaxis 825. For example, one or more motors (not shown) located in thebase 814 may rotate the first upper arm 820A about the second rotationalaxis 825.

The robot apparatus 102C may further include a second upper arm 820Brotatably coupled to the second lower arm 810B at a sixth rotationalaxis 835 that is spaced away from the first rotational axis 815. Secondupper arm 820B may be configured to rotate about the sixth rotationalaxis 835. For example, one or more motors (not shown) located in thebase 814 may rotate the second upper arm 820B about the sixth rotationalaxis 835.

The robot apparatus 102C may further include a first forearm 830Arotatably coupled to the first upper arm 820A at a seventh rotationalaxis 845 spaced from the second rotational axis 825. The first forearm830A may include a first bend in a first direction within a horizontalplane. The first forearm may be configured to independently rotate aboutthe seventh rotational axis 845. For example, one or more motors (notshown) located in the base 814 may independently rotate the firstforearm 830A about the seventh rotational axis 545 for both, the dualsubstrate handling mode and the single substrate handling mode.

The robot apparatus 102C may further include a second forearm 830Brotatably coupled to the second upper arm 820B at an eighth rotationalaxis 855 spaced from the sixth rotational axis 835. The second forearm830B may include a second bend in a second direction within a horizontalplane, wherein the second direction is opposite the first direction. Thesecond forearm may be configured to independently rotate about theeighth rotational axis 855. For example, one or more motors (not shown)located in the base 814 may independently rotate the second forearm 830Babout the eighth rotational axis 855 for both, the dual substratehandling mode and the single substrate handling mode.

The robot apparatus 102C may further include a first end effector 840Athat is coupled (optionally rotatably) to the first forearm 830A,optionally through a first wrist 850A. The robot apparatus 102C may alsoinclude a second end effector 840B that is coupled (optionallyrotatably) to the second forearm 830B, optionally through a second wrist850B.

In robot apparatus 102C, the first lower arm 810A, the second lower arm810B, the first upper arm 820A, the second upper arm 820B, the firstforearm 830A, the second forearm 830B, optionally the first wrist 850A,optionally the second wrist 850B, the first end effector 840A, and thesecond end effector 840B form together a “W” shape when the robotapparatus 102C is in a contracted (or folded) configuration as shown inFIG. 8B.

In robot apparatus 102C, the first lower arm 810A, the second lower arm810B, the first upper arm 820A, the second upper arm 820B, the firstforearm 830A, the second forearm 830B, optionally the first wrist 850A,optionally the second wrist 850B, the first end effector 840A, and thesecond end effector 840B form together a “V” shape when the robotapparatus 102C is in a an extended configuration, suitable for reachinginto load lock chambers (e.g., load lock chambers 122) or into processchambers (e.g., process chambers 120) in a dual substrate operatingmode, as shown in FIG. 8C.

In robot apparatus 102C, the first lower arm 810A, the second lower arm810B, the first upper arm 820A, the second upper arm 820B, the firstforearm 830A, the second forearm 830B, optionally the first wrist 850A,optionally the second wrist 850B, the first end effector 840A, and thesecond end effector 840B are configured to independently rotate abouttheir corresponding rotational axis (e.g., about the first rotationalaxis 815, about the second rotational axis 825, about the sixthrotational axis 835, about the seventh rotational axis 845, about theeighth rotational axis 855, and/or about additional rotational axis (ifany)) for both, the dual substrate handling mode and the singlesubstrate handling mode.

For example, one or more motors (not shown) located in the base 814 mayindependently rotate the first lower arm 810A and the second lower arm810B about the first rotational axis 815, the first upper arm 820A aboutthe second rotational axis 825, the second upper arm 820B about thesixth rotational axis 835, the first forearm 830A about the seventhrotational axis 845, and the second forearm 830B about the eighthrotational axis 855 for both, the dual substrate handling mode and thesingle substrate handling mode.

During operation, robot apparatus 102C may move along linear track 816to access various process chambers 920 or load lock chambers 922.Similarly, robot apparatus 102C may operate in single substrate handlingmode, dual substrate handling mode, or a combination thereof to loadand/or unload process chambers 920 and load lock chambers 922 inelectronic device processing system 900, shown in FIG. 9.

For robot apparatus 102C, operating in dual substrate handling modeincludes independently rotating the first lower arm 810A, the secondlower arm 810B, the first upper arm 820A, the second upper arm 820B, thefirst forearm 830A, the second forearm 830B, optionally the first wrist850A, optionally the second wrist 850B, the first end effector 840A, andthe second end effector 840B, about the first rotational axis 815, thesecond rotational axis 825, the sixth rotational axis 835, the seventhrotational axis 845, and the eighth rotational axis 855 to space thefirst end effector 850A from the second effector 850B by the first pitchD91 or by the second pitch D92.

As can be seen in FIG. 9, in some embodiments, the first pitch D91 ismeasured between a first end point 942A of the first end effector 940Aand a second end point 942B of the second end effector 940B, as shown inthe FIG. 9 configuration, and said first pitch D91 corresponds to thedistance between the centers of two horizontally adjacent load lockchambers 922. In some embodiments, the first pitch D91 between centersof the two adjacent load lock chambers 922 may be in a range of about 20inches to about 25 inches. In some embodiments, the first pitch D91between centers of two adjacent load lock chambers 922 may be in a rangeof about 21 inches to about 23 inches. In some embodiments, the firstpitch D91 between centers of two adjacent load lock chambers 922 may beabout 22 inches. Other distances for the first pitch D91 may also bepossible.

As can be seen in FIG. 9, in some embodiments, the second pitch D92 ismeasured between a first end point 942A of the first end effector 940Aand a second end point 942B of the second end effector 940B, as shown inthe FIG. 9 configuration, and said second pitch D92 corresponds to thedistance between the centers of two horizontally adjacent load lockchambers 922. In some embodiments, the second pitch D92 between centersof the two adjacent load lock chambers 922 may be in a range of about 20inches to about 25 inches. In some embodiments, the second pitch D92between centers of two adjacent load lock chambers 922 may be in a rangeof about 21 inches to about 23 inches. In some embodiments, the secondpitch D92 between centers of two adjacent load lock chambers 922 may beabout 22 inches. Other distances for the second pitch D91 may also bepossible.

For robot apparatus 102C, operating in single substrate handling modeincludes independently rotating the first lower arm 810A, the secondlower arm 810B, the first upper arm 820A, the second upper arm 820B, thefirst forearm 830A, the second forearm 830B, optionally the first wrist850A, optionally the second wrist 850B, the first end effector 840A, andthe second end effector 840B, about the first rotational axis 815, thesecond rotational axis 825, the sixth rotational axis 835, the seventhrotational axis 845, and the eighth rotational axis 855 to align thefirst end effector 840A and the second end effector 840B in aconfiguration suitable for one of the first end effector 840A or thesecond end effector 840B to access one load lock chamber 922 or oneprocess chamber 920.

The foregoing description discloses example embodiments of thedisclosure. Modifications of the above-disclosed apparatus, systems, andmethods which fall within the scope of the disclosure will be readilyapparent to those of ordinary skill in the art. Accordingly, while thepresent disclosure has been disclosed in connection with exampleembodiments, it should be understood that other embodiments may fallwithin the scope of the disclosure, as defined by the claims.

What is claimed is:
 1. A robot apparatus, comprising: at least one lowerarm configured to rotate about a first rotational axis; at least oneupper arm rotatably coupled to the at least one lower arm at a secondrotational axis that is spaced away from the first rotational axis; afirst end effector rotatably coupled to the at least one upper armoptionally through a first forearm; and a second end effector rotatablycoupled to the at least one upper arm optionally through a secondforearm, wherein the first end effector and the second end effector areco-planar, and wherein the first end effector and the second endeffector are configured to transfer substrates between one or morechambers associated with substrate processing, wherein the first endeffector and the second end effector are configured to independentlyrotate about one or more additional rotational axis that are differentfrom the first rotational axis and from the second rotational axis tospace the first end effector from the second end effector by a firstpitch or by a second pitch that is different from the first pitch. 2.The robot apparatus of claim 1, wherein: the robot apparatus isconfigured to operate both in a dual substrate handling mode and in asingle substrate handling mode; in the dual substrate handling mode, thefirst end effector and the second end effector are to independentlyrotate about the one or more additional rotational axis to space thefirst end effector from the second end effector by the first pitch or bythe second pitch, wherein at least one of the first pitch or the secondpitch is suitable for the first end effector and the second end effectorto concurrently access separate load lock chambers or separate processchambers; and in the single substrate handling mode, the first endeffector and the second end effector are to independently rotate aboutthe one or more additional rotational axis to align the first endeffector and the second end effector at a configuration suitable for oneof the first end effector or the second end effector to access one loadlock chamber or one process chamber.
 3. The robot apparatus of claim 1,wherein the first pitch is in a range of about 20 inches to about 25inches, and wherein the second pitch is in a range of about 32 inches toabout 40 inches.
 4. The robot apparatus of claim 1, wherein the firstpitch is about 22 inches, and wherein the second pitch is about 36inches.
 5. The robot apparatus of claim 1, wherein: the at least onelower arm comprises one lower arm configured to rotate about the firstrotational axis; the at least one upper arm comprises one upper armrotatably coupled to the one lower arm at the second rotational axisthat is spaced away from the first rotational axis; the first endeffector is rotatably coupled to the one upper arm at a third rotationalaxis, wherein the first end effector comprises a first bend in a firstdirection within a horizontal plane; and the second end effector isrotatably coupled to the one upper arm at the third rotational axis,wherein the second end effector comprises a second bend in a seconddirection within the horizontal plane, wherein the second direction isopposite the first direction, wherein the first end effector and thesecond end effector are configured to rotate independently about thethird rotational axis.
 6. The robot apparatus of claim 1, wherein: theat least one lower arm comprises one lower arm configured to rotateabout the first rotational axis; the at least one upper arm comprisesone upper arm rotatably coupled to the one lower arm at the secondrotational axis that is spaced away from the first rotational axis; afirst forearm and a second forearm, each rotatably coupled to the oneupper arm at a third rotational axis; the first end effector rotatablycoupled to the first forearm at a fourth rotational axis; and the secondend effector rotatably coupled to the second forearm at a fifthrotational axis, wherein the first forearm, the second forearm, thefirst end effector, and the second end effector, are configured torotate independently about the third rotational axis, the fourthrotational axis, and the fifth rotational axis.
 7. The robot apparatusof claim 1, further comprising a body mounted on a linear track, whereinthe body is configured to move along the linear track, wherein the atleast one lower arm and the at least one upper arm are coupled to thebody, and wherein: the at least one lower arm comprises: a first lowerarm configured to rotate about a first rotational axis; and a secondlower arm configured to rotate about the first rotational axis; the atleast one upper arm comprises: a first upper arm rotatably coupled tothe first lower arm at the second rotational axis that is spaced awayfrom the first rotational axis; and a second upper arm rotatably coupledto the second lower arm at a sixth rotational axis that is spaced awayfrom the first rotational axis; a first forearm rotatably coupled to thefirst upper arm at a seventh rotational axis, wherein the first forearmcomprises a first bend in a first direction within a horizontal plane; asecond forearm rotatably coupled to the second upper arm at an eighthrotational axis, wherein the second forearm comprises a second bend in asecond direction within the horizontal plane, wherein the seconddirection is opposite the first direction; a first end effector coupledto the first forearm, optionally through a first wrist; and a second endeffector coupled to the second forearm, optionally through a secondwrist, wherein the first lower arm, the second lower arm, the firstupper arm, the second upper arm, the first forearm, the second forearm,optionally the first wrist, optionally the second wrist, the first endeffector, and the second end effector form together a “W” shape, and areconfigured to independently rotate about the first rotational axis, thesecond rotational axis, the sixth rotational axis, the seventhrotational axis, and the eighth rotational axis.
 8. An electronic deviceprocessing system, comprising: a transfer chamber; two adjacent loadlock chambers coupled to the transfer chamber, wherein the two adjacentload lock chambers are horizontally spaced by a first pitch; four ormore process chambers coupled to the transfer chamber, wherein at leastone pair of adjacent process chambers of the four or more processchambers are spaced by a second pitch that is different from the firstpitch; and a robot apparatus at least partially located within thetransfer chamber, the robot apparatus comprising: at least one lower armconfigured to rotate about a first rotational axis; at least one upperarm rotatably coupled to the at least one lower arm at a secondrotational axis that is spaced away from the first rotational axis; afirst end effector rotatably coupled to the at least one upper armoptionally through a first forearm; and a second end effector rotatablycoupled to the at least one upper arm optionally through a secondforearm, wherein the first end effector and the second end effector areco-planar, and wherein the first end effector and the second endeffector are configured to transfer substrates between one or morechambers associated with substrate processing, wherein the first endeffector and the second end effector are configured to independentlyrotate about one or more additional rotational axis that are differentfrom the first rotational axis and from the second rotational axis tospace the first end effector from the second end effector by a firstpitch or by a second pitch that is different from the first pitch. 9.The electronic device processing system of claim 8, wherein: the robotapparatus is configured to operate both in a dual substrate handlingmode and in a single substrate handling mode; in the dual substratehandling mode, the first end effector and the second end effector are toindependently rotate about one or more additional rotational to spacethe first end effector from the second end effector by the first pitchor by the second pitch to enable the first end effector and the secondend effector to concurrently access the two adjacent load lock chambersor the at least one pair of adjacent process chambers; and in the singlesubstrate handling mode, the first end effector and the second endeffector are to independently rotate about the one or more additionalrotational axis to align the first end effector and the second endeffector at a configuration suitable for one of the first end effectoror the second end effector to access one load lock chamber or oneprocess chamber.
 10. The electronic device processing system of claim 8,wherein the first pitch is in a range of about 20 inches to about 25inches, and wherein the second pitch is in a range of about 32 inches toabout 40 inches.
 11. The electronic device processing system of claim 8,wherein, in the robot apparatus: the at least one lower arm comprisesone lower arm configured to rotate about the first rotational axis; theat least one upper arm comprises one upper arm rotatably coupled to theone lower arm at the second rotational axis that is spaced away from thefirst rotational axis; the first end effector is rotatably coupled tothe one upper arm at a third rotational axis, wherein the first endeffector comprises a first bend in a first direction within a horizontalplane; and the second end effector is rotatably coupled to the one upperarm at the third rotational axis, wherein the second end effectorcomprises a second bend in a second direction within the horizontalplane, wherein the second direction is opposite the first direction,wherein the first end effector and the second end effector areconfigured to rotate independently about the third rotational axis. 12.The electronic device processing system of claim 8, wherein, in therobot apparatus: the at least one lower arm comprises one lower armconfigured to rotate about the first rotational axis; the at least oneupper arm comprises one upper arm rotatably coupled to the one lower armat the second rotational axis that is spaced away from the firstrotational axis; a first forearm and a second forearm, each rotatablycoupled to the one upper arm at a third rotational axis; the first endeffector rotatably coupled to the first forearm at a fourth rotationalaxis; and the second end effector rotatably coupled to the secondforearm at a fifth rotational axis, wherein the first forearm, thesecond forearm, the first end effector, and the second end effector, areconfigured to rotate independently about the third rotational axis, thefourth rotational axis, and the fifth rotational axis.
 13. Theelectronic device processing system of claim 8, wherein the robotapparatus further comprises a body mounted on a linear track, whereinthe body is configured to move along the linear track, wherein the atleast one lower arm and the at least one upper arm are coupled to thebody, and wherein, in the robot apparatus: the at least one lower armcomprises: a first lower arm configured to rotate about a firstrotational axis; and a second lower arm configured to rotate about thefirst rotational axis; the at least one upper arm comprises: a firstupper arm rotatably coupled to the first lower arm at the secondrotational axis that is spaced away from the first rotational axis; anda second upper arm rotatably coupled to the second lower arm at a sixthrotational axis that is spaced away from the first rotational axis; afirst forearm rotatably coupled to the first upper arm at a seventhrotational axis, wherein the first forearm comprises a first bend in afirst direction within a horizontal plane; a second forearm rotatablycoupled to the second upper arm at an eighth rotational axis, whereinthe second forearm comprises a second bend in a second direction withinthe horizontal plane, wherein the second direction is opposite the firstdirection; a first end effector coupled to the first forearm, optionallythrough a first wrist; and a second end effector coupled to the secondforearm, optionally through a second wrist, wherein the first lower arm,the second lower arm, the first upper arm, the second upper arm, thefirst forearm, the second forearm, optionally the first wrist,optionally the second wrist, the first end effector, and the second endeffector form together a “W” shape, and are configured to independentlyrotate about the first rotational axis, the second rotational axis, thesixth rotational axis, the seventh rotational axis, and the eighthrotational axis.
 14. The electronic device processing system of claim 8,comprising from 4 to 24 process chambers.
 15. A method of transferringsubstrates, comprising operating a robot apparatus in a dual substratehandling mode and in a single substrate handling mode, wherein the robotapparatus comprises: at least one lower arm configured to rotate about afirst rotational axis; at least one upper arm rotatably coupled to theat least one lower arm at a second rotational axis that is spaced awayfrom the first rotational axis; a first end effector rotatably coupledto the at least one upper arm optionally through a first forearm; and asecond end effector rotatably coupled to the at least one upper armoptionally through a second forearm, wherein operating in a dualsubstrate handling mode comprises independently rotating the first endeffector and the second end effector, about one or more additionalrotational axis that are different from the first rotational axis andfrom the second rotational axis, to space the first end effector fromthe second end effector by a first pitch or by a second pitch that isdifferent from the first pitch, wherein at least one of the first pitchor the second pitch is suitable for the first end effector and thesecond end effector to concurrently access separate load lock chambersor separate process chambers, wherein operating in a single substratehandling mode comprises independently rotating the first end effectorand the second end effector, about the one or more additional rotationalaxis, to align the first end effector and the second end effector in aconfiguration suitable for one of the first end effector or the secondend effector to access one load lock chamber or one process chamber. 16.The method of claim 15, wherein the first pitch is in a range of about20 inches to about 25 inches, and wherein the second pitch is in a rangeof about 32 inches to about 40 inches.
 17. The method of claim 15,wherein, in the robot apparatus: the at least one lower arm comprisesone lower arm configured to rotate about the first rotational axis; theat least one upper arm comprises one upper arm rotatably coupled to theone lower arm at the second rotational axis that is spaced away from thefirst rotational axis; the first end effector is rotatably coupled tothe one upper arm at a third rotational axis, wherein the first endeffector comprises a first bend in a first direction within a horizontalplane; and the second end effector is rotatably coupled to the one upperarm at the third rotational axis, wherein the second end effectorcomprises a second bend in a second direction within the horizontalplane, wherein the second direction is opposite the first direction,wherein operating in the dual substrate handling mode comprisesindependently rotating the first end effector and the second endeffector, about the third rotational axis, to space the first endeffector from the second end effector by the first pitch or by thesecond pitch, and wherein operating in the single substrate handlingmode comprises independently rotating the first end effector and thesecond end effector, about the third rotational axis, to align the firstend effector and the second end effector in a configuration suitable forone of the first end effector or the second end effector to access oneload lock chamber or one process chamber.
 18. The method of claim 15,wherein, in the robot apparatus: the at least one lower arm comprisesone lower arm configured to rotate about the first rotational axis; theat least one upper arm comprises one upper arm rotatably coupled to theone lower arm at the second rotational axis that is spaced away from thefirst rotational axis; a first forearm and a second forearm, eachrotatably coupled to the one upper arm at a third rotational axis; thefirst end effector rotatably coupled to the first forearm at a fourthrotational axis; and the second end effector rotatably coupled to thesecond forearm at a fifth rotational axis, wherein operating in the dualsubstrate handling mode comprises independently rotating the firstforearm, the second forearm, the first end effector, and the second endeffector, about the third rotational axis, the fourth rotational axis,and the fifth rotational axis to space the first end effector from thesecond end effector by the first pitch or by the second pitch, andwherein operating in the single substrate handling mode comprisesindependently rotating the first forearm, the second forearm, the firstend effector, and the second end effector, about the third rotationalaxis, the fourth rotational axis, and the fifth rotational axis to alignthe first end effector and the second end effector in a configurationsuitable for one of the first end effector or the second end effector toaccess one load lock chamber or one process chamber.
 19. The method ofclaim 15, wherein the robot apparatus further comprises a body mountedon a linear track, wherein the body is configured to move along thelinear track, wherein the at least one lower arm and the at least oneupper arm are coupled to the body, and wherein, in the robot apparatus:the at least one lower arm comprises: a first lower arm configured torotate about a first rotational axis; and a second lower configured torotate about the first rotational axis; the at least one upper armcomprises: a first upper arm rotatably coupled to the first lower arm atthe second rotational axis that is spaced away from the first rotationalaxis; and a second upper arm rotatably coupled to the second lower armat a sixth rotational axis that is spaced away from the first rotationalaxis; a first forearm rotatably coupled to the first upper arm at aseventh rotational axis, wherein the first forearm comprises a firstbend in a first direction within a horizontal plane; a second forearmrotatably coupled to the second upper arm at an eighth rotational axis,wherein the second forearm comprises a second bend in a second directionwithin the horizontal plane, wherein the second direction is oppositethe first direction; a first end effector coupled to the first forearm,optionally through a first wrist; and a second end effector coupled tothe second forearm, optionally through a second wrist, wherein operatingin the dual substrate handling mode comprises independently rotating thefirst lower arm, the second lower arm, the first upper arm, the secondupper arm, the first forearm, the second forearm, optionally the firstwrist, optionally the second wrist, the first end effector, and thesecond end effector, about the first rotational axis, the secondrotational axis, the sixth rotational axis, the seventh rotational axis,and the eighth rotational axis to space the first end effector from thesecond end effector by the first pitch or by the second pitch, andwherein operating in the single substrate handling mode comprisesindependently rotating the first lower arm, the second lower arm, thefirst upper arm, the second upper arm, the first forearm, the secondforearm, optionally the first wrist, optionally the second wrist, thefirst end effector, and the second end effector, about the firstrotational axis, the second rotational axis, the sixth rotational axis,the seventh rotational axis, and the eighth rotational axis to align thefirst end effector and the second end effector in a configurationsuitable for one of the first end effector or the second end effector toaccess one load lock chamber or one process chamber.
 20. An electronicdevice processing system, comprising: a transfer chamber with a center;two adjacent load lock chambers coupled to the transfer chamber, whereinthe two adjacent load lock chambers are horizontally spaced by a firstpitch; four or more process chambers coupled to the transfer chamber,wherein at least one pair of adjacent process chambers of the four ormore process chambers are spaced by a second pitch that is differentfrom the first pitch; and a robot apparatus at least partially locatedwithin the transfer chamber, the robot apparatus comprising: at leastone lower arm configured to rotate about a first rotational axis,wherein the first rotational axis is offset from the center of thetransfer chamber; at least one upper arm rotatably coupled to the atleast one lower arm at a second rotational axis that is spaced away fromthe first rotational axis; a first end effector rotatably coupled to theat least one upper arm optionally through a first forearm; and a secondend effector rotatably coupled to the at least one upper arm optionallythrough a second forearm, wherein the robot apparatus is configured tooperate in a dual substrate handling mode, and wherein, in the dualsubstrate handling mode, the first end effector and the second endeffector are to independently rotate about one or more additionalrotational axis that are different from the first rotational axis andfrom the second rotational axis to space the first end effector from thesecond end effector by the first pitch or by the second pitch that isdifferent from the first pitch to enable the first end effector and thesecond end effector to concurrently access the two adjacent load lockchambers or the at least one pair of adjacent process chambers.